Services Provided

The long list of benefits from producing reliable and maintainable products is undeniable. Realizing these benefits is only achieved through efficient design analysis. For this reason, we are available to provide the following services:

• Development of Life Test Plans
• Life Cycle Testing
• Thermal Stress Testing
• MTBF, MTTF or MTTR, predictions based on:

   MIL-HBK-217, FN2, Part Stress and Parts Count,
   Telcordia SR332, Issue 1,2,3,4 "Reliability Prediction Procedure for Electronic Equipment"
   Mechanical Parts Reliability Prediction Method
   

Standards and Reliability Models, Which is for you?

A primary component of reliability analysis is referred to as the failure rate, or the number of failures expected during a certain period of time. Calculation of equipment failure rate, and its inverse - the MTBF (Mean Time Between Failures), is the basis of the Reliability Prediction.

There are several different reliability models available, including MIL-HDBK-217 Part Stress and Parts Count, the Telcodia Reliability Prediction Method, and a Mechanical Parts reliability prediction method. Your choice of a reliability prediction model, or models, depends upon your application.

The Part Stress section of MIL-HDBK-217, the worldwide standard for electronic reliability analysis, allows you to take into account the various stress factors, such as power, voltage, and temperature, on your components. An extensive and widely used standard, MIL-HDBK-217 may be employed for any application.

The Parts Count is section of MIL-HDBK-217 is similar to Part Stress MIL-HDBK-217, except that it provides simpler reliability models by defaulting most of the part parameters contained in MIL-HDBK-217 to average values. The Parts Count analysis is especially useful in the early design phase of a product when the component and operating parameters may not be known.